View 2PA1774QMB_8298602.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

1. product profile 1.1 general description pnp general-purpose transistors in a leadless ultra small dfn1006b-3 (sot883b) surface-mounted device (smd) plastic package. 1.2 features and benefits 1.3 applications ? general-purpose switching and amplification ? mobile applications 1.4 quick reference data 2pa1774xmb series 40 v, 100 ma pnp gene ral-purpose transistors rev. 1 ? 23 march 2012 product data sheet sot883b table 1. product overview type number package npn complement nxp jeita jedec 2PA1774QMB sot883b - - 2pc4617qmb 2pa1774rmb sot883b - - 2pc4617rmb 2pa1774smb sot883b - - - ? leadless ultra small smd plastic package ? power dissipation comparable to sot23 ? low package height of 0.37 mm ? aec-q101 qualified table 2. quick reference data symbol parameter conditions min typ max unit v ceo collector-emitter voltage open base - - ? 40 v i c collector current - - ? 100 ma h fe dc current gain v ce = ? 6v; i c = ? 1ma 2PA1774QMB 120 - 270 2pa1774rmb 180 - 390 2pa1774smb 270 - 560
2pa1774xmb_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 23 march 2012 2 of 12 nxp semiconductors 2pa1774xmb series 40 v, 100 ma pnp general-purpose transistors 2. pinning information 3. ordering information 4. marking [1] for dfn1006b-3 (sot883b) binary marking code description see figure 1 . 4.1 binary marking code description table 3. pinning pin description simplified outline graphic symbol 1base 2emitter 3 collector 3 1 2 transparent top view sym013 3 2 1 table 4. ordering information type number package name description version 2pa1774xmb series dfn1006b-3 leadless ultra small plastic package; 3 solder lands; body 1.0 ? 0.6 ? 0.37 mm sot883b table 5. marking codes type number marking code [1] 2PA1774QMB 0100 0000 2pa1774rmb 0000 1101 2pa1774smb 0000 1110 fig 1. dfn1006b-3 (sot883b) binary marking code description marking code (example) pin 1 indication reading direction reading direction reading example: 0111 1011 006aac673
2pa1774xmb_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 23 march 2012 3 of 12 nxp semiconductors 2pa1774xmb series 40 v, 100 ma pnp general-purpose transistors 5. limiting values [1] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated and standard footprint. [2] reflow soldering is the only recommended soldering method. [3] device mounted on an fr4 pcb, single-sided copper, mounting pad for collector 1 cm 2 . table 6. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v cbo collector-base voltage open emitter - ? 50 v v ceo collector-emitter voltage open base - ? 40 v v ebo emitter-base voltage open collector - ? 5v i c collector current - ? 100 ma i cm peak collector current single pulse; t p ? 1ms - ? 200 ma i bm peak base current single pulse; t p ? 1ms - ? 100 ma p tot total power dissipation t amb ? 25 ?c [1] [2] -250mw [3] [2] -590mw t j junction temperature - 150 ?c t amb ambient temperature ? 55 +150 ?c t stg storage temperature ? 65 +150 ?c
2pa1774xmb_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 23 march 2012 4 of 12 nxp semiconductors 2pa1774xmb series 40 v, 100 ma pnp general-purpose transistors 6. thermal characteristics [1] device mounted on an fr4 pcb, single-si ded copper, tin-plated and standard footprint. [2] reflow soldering is the only recommended soldering method. [3] device mounted on an fr4 pcb, single-sided copper, mounting pad for collector 1 cm 2 . table 7. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] [2] - - 500 k/w [3] [2] - - 212 k/w fr4 pcb, standard footprint fig 2. transient thermal impedance from junction to am bient as a function of pu lse duration; typical values 006aab603 10 ?5 10 10 ?2 10 ?4 10 2 10 ?1 t p (s) 10 ?3 10 3 1 10 2 10 10 3 z th(j-a) (k/w) 1 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 0
2pa1774xmb_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 23 march 2012 5 of 12 nxp semiconductors 2pa1774xmb series 40 v, 100 ma pnp general-purpose transistors 7. characteristics [1] pulse test: t p ? 300 ? s; ?? 0.02. table 8. characteristics t amb =25 ? c unless otherwise specified. symbol parameter conditions min typ max unit i cbo collector-base cut-off current v cb = ? 30 v; i e =0a - - ? 100 na v cb = ? 30 v; i e =0a; t j = 150 ?c -- ? 5 ? a i ebo emitter-base cut-off current v eb = ? 4v; i c =0a - - ? 100 na h fe dc current gain v ce = ? 6v; i c = ? 1ma 2PA1774QMB 120 - 270 2pa1774rmb 180 - 390 2pa1774smb 270 - 560 v cesat collector-emitter saturation voltage i c = ? 50 ma; i b = ? 5ma [1] -- ? 200 mv f t transition frequency v ce = ? 12 v; i c = ? 2ma; f = 100 mhz 100 - - mhz c c collector capacitance v cb = ? 12 v; i e =i e =0a; f=1mhz --2.2pf
2pa1774xmb_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 23 march 2012 6 of 12 nxp semiconductors 2pa1774xmb series 40 v, 100 ma pnp general-purpose transistors v ce = ?6v (1) t amb = ?55 ? c (2) t amb =25 ? c (3) t amb = 150 ? c i c /i b =10 (1) t amb = 150 ? c (2) t amb =25 ? c (3) t amb = ?55 ? c fig 3. base-emitter voltage as a function of collector current; typical values fig 4. collector-emitter saturation voltage as a function of collector current; typical values i c /i b =10 (1) t amb = ?55 ? c (2) t amb =25 ? c (3) t amb = 150 ? c i c /i b =10 (1) t amb = 150 ? c (2) t amb =25 ? c (3) t amb = ?55 ? c fig 5. base-emitter saturation voltage as a function of collector current; typical values fig 6. collector-emitter equivalent on-resistance as a function of collector current; typical values mdb664 v be (mv) ?400 ?200 ?600 ?1000 ?800 ?1200 i c (ma) ?10 ?1 ?1 ?10 ?10 2 ?10 3 (1) (2) (3) mdb665 i c (ma) ?10 ?1 ?1 ?10 ?10 2 ?10 3 ?10 3 v cesat (mv) ?10 2 ?10 (1) (3) (2) mdb666 v besat (mv) ?400 ?200 ?600 -1000 ?800 ?1200 ?10 ?1 ?1 ?10 ?10 2 i c (ma) (1) (3) (2) mdb668 i c (ma) ?10 ?1 ?1 ?10 ?10 2 ?10 3 r cesat () 10 3 10 2 10 1 (2) (3) (1)
2pa1774xmb_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 23 march 2012 7 of 12 nxp semiconductors 2pa1774xmb series 40 v, 100 ma pnp general-purpose transistors 8. test information 8.1 quality information this product has been qualified in accordance with the automotive electronics council (aec) standard q101 - stress test qualificat ion for discrete semiconductors , and is suitable for use in automotive applications. 9. package outline 10. packing information [1] for further information and the avai lability of packing methods, see section 14 . fig 7. package outline dfn1006b-3 (sot883b) 11-11-02 dimensions in mm 2 3 0.55 0.47 0.30 0.22 1 0.40 0.34 0.30 0.22 0.20 0.12 0.65 0.04 max 0.35 0.65 0.55 1.05 0.95 table 9. packing methods the indicated -xxx are the last thre e digits of the 12nc ordering code. [1] type number package description packing quantity 10000 2pa1774xmb series dfn1006b-3 (sot883b) 2 mm pitch, 8 mm tape and reel -315
2pa1774xmb_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 23 march 2012 8 of 12 nxp semiconductors 2pa1774xmb series 40 v, 100 ma pnp general-purpose transistors 11. soldering reflow soldering is the only recommended soldering method. fig 8. reflow soldering footprint dfn1006b-3 (sot883b) 1.3 0.3 0.6 0.7 0.4 0.9 0.3 (2x) 0.4 (2x) 0.25 (2x) r0.05 (8x) 0.7 footprint information for reflow soldering sot883b sot883b_fr occupied area solder land solder resist solder land plus solder paste solder paste deposit dimensions in mm
2pa1774xmb_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 23 march 2012 9 of 12 nxp semiconductors 2pa1774xmb series 40 v, 100 ma pnp general-purpose transistors 12. revision history table 10. revision history document id release date data sheet status change notice supersedes 2pa1774xmb_ser v.1 20120323 product data sheet - -
nxp semiconductors 2pa1774xmb series 40 v, 100 ma pnp general-purpose transistors ? nxp b.v. 2012. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 23 march 2012 document identifier: 2pa1774xmb_ser please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 13.2 definitions draft ? the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed other wise in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 13.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (includi ng negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and r eplaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
2pa1774xmb_ser all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 1 ? 23 march 2012 11 of 12 nxp semiconductors 2pa1774xmb series 40 v, 100 ma pnp general-purpose transistors limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms an d conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from competent authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comp lete, exhaustive or legally binding. 13.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 14. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors 2pa1774xmb series 40 v, 100 ma pnp general-purpose transistors ? nxp b.v. 2012. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 23 march 2012 document identifier: 2pa1774xmb_ser please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 15. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4.1 binary marking code description. . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 thermal characteristics . . . . . . . . . . . . . . . . . . 4 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 8.1 quality information . . . . . . . . . . . . . . . . . . . . . . 7 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 packing information . . . . . . . . . . . . . . . . . . . . . 7 11 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 legal information. . . . . . . . . . . . . . . . . . . . . . . 10 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 13.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 13.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 14 contact information. . . . . . . . . . . . . . . . . . . . . 11 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

▲Up To Search▲

Price & Availability of 2PA1774QMB

	To Download 2PA1774QMB Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .